SOLANKI BOTTLES PRIVATE LIMITED

Precision manufacture of bare printed circuit boards (single, double, and multi-layer) tailored for electronics OEMs and component assemblers across Maharashtra, Haryana, and Uttar Pradesh. Processes include controlled lamination, pattern plating, via formation, and surface finish options (HASL, ENIG) with in-line optical inspection to ensure yield and impedance control.

NIC 26104 — Section C; Division 26; Group 261; Class 2610. Typical lead times: 4–8 weeks depending on complexity.

Automated surface-mount technology (SMT) pick-and-place and reflow processes for mass and batch runs, including stencil printing, AOI, X-ray inspection, and selective soldering. Able to handle mixed-technology boards, BGA rework, and high-density interconnects for telecom, industrial controls, and consumer electronics customers in the National Capital Region.

Turnkey PCB assembly aligned with NIC 26104 scope. Capacity: up to medium-volume production with QA traceability.

Electrical test, functional test fixtures, in-circuit testing (ICT), boundary-scan, and environmental stress screening (thermal cycling, humidity) to validate product reliability before shipment. Detailed test reports and failure analysis provided to support field readiness and regulatory compliance.

Post-assembly validation services with ISO-aligned QA records. Typical throughput: parallel testing for small-to-medium batches.

Manufacture of bare printed circuit boards including single, double and multilayer boards, controlled impedance, via filling, and finishing options. Processes include CAM checking, phototooling, etching, lamination, drilling, plating and final electrical testing to industry standards.

Core capability aligned with NIC 26104

Automated pick-and-place component loading, reflow soldering, and selective soldering for mixed-technology assemblies. In-line optical inspection, AOI, and functional testing are available to ensure assembly quality and manufacturing yield.

Supports component loading onto PCBs

Comprehensive QC program including IPC-compliant inspections, ICT functional testing, X-ray for BGA inspection, environmental stress screening, and full documentation for RoHS/CE/UL compliance. Failure analysis and corrective action processes support continuous improvement.

Ensures product reliability and regulatory compliance